| Design rules WE CHECK ALL SUBMITTED FILES FOR THE FOLLOWING ERRORS FREE OF CHARGE, AND, WHERE IT IS POSSIBLE, WE CORRECT THEM OR WE CONTACT THE CUSTOMER FOR CORRECTIONS. Spacing
All spaces between two copper entities must be, at least, 6 mils (0,15 mm) far each other. Track width
All copper entities must be drawn with a 6 mils (0,15 mm) or larger track width. Anular Ring and Minimum drill size
The smallest drill size we can drill is 16 mils (0,4 mm) and it must have an anular ring of, at least, 6 mils (0,15 mm) for drills smaller than 79 mils (2,0 mm) and 8/10 mils for bigger drills. Since anular ring affect solderability, it's recomended to use an anular ring of 8/10 mils (0,20 mm) or bigger on every pad and use 6 mils anular ring only for vias. For example a vias with a 16 mils diameter (0,4 mm) must have a corresponding PAD diameter of 28 mils (16 + 6 + 6 mils = 28 mils = 0,71 mm) Solder Mask Spacing
Solder mask swell should be at least 8 mils (0,20 mm) larger than copper surfaces to keep mask off pads. Silkscreen keepout from copper
We will try to correct this problem if occur, but, sometimes, due to particular DCODE shapes used in Silkscreen Layer, the check will pass OK even if there is some silkscreen on copper surfaces. You should be very carefull in checking this because it can cause difficulties in solderability of the components on the board, especially if SMD technology. Mechanical - Contour Routing
Copper entities must be at least 8 mils (0,20 mm) far from the border outline. The border outline is routed with a 2 mm routing tool, and, where necessary, with a 1 mm routing tool. Any shape is possible, but you have to draw your board outline at least on one layer (copper, soldermask, silkscreen or a specific file for dimensions). Mechanical - Internal Cutout
Internal cutout is possible but is subject to approval. The smaller routing tool we can use is 1 mm. |